Intel BPK-72  
Written by Accutron on 2007-04-27  

Devices included in this entry:

Intel 7110-1 bubble memory (20-pin ceramic LCC; pictured in thumbnail)
Intel D7220-1 bubble memory controller (40-pin ceramic sandwich DIP)
Intel D7230 current pulse generator (22-pin ceramic sandwich DIP)
Intel D7242 sense amplifier (20-pin ceramic sandwich DIP)
Intel D7250 coil pre-drive (16-pin ceramic sandwich DIP)

The Intel BPK-72 family consists of the 7110 high density 1-megabit bubble memory device and its associated support chips. The 7110 has 256 data loops of 4096 bits each, arranged as 2048 512-bit pages. The 7110 has separate input and output tracks, as well as other advanced architectural features.

The example pictured here is a 7110-1, the first incarnation of the 7110, with a 20-pin leadless carrier and medium ambient temperature tolerance. 'A' variants (7110A-1, 7110A-4, 7110A-5) have standard tinned through-hole pins. Variants with the -4 suffix (7110-4, 7110A-4) have low temperature tolerance, while -5 variants (7110-5, 7110A-5) have high temperature tolerance. Additionally, there are 'AZ' types with through-hole pins (7110AZ-1, 7110AZ-4) whose performance characteristics are currently unknown.

It should also be noted that some early documentation refers to the 7110-4 as the 7110-0 or simply 7110 with no suffix, and the 7110-5 is listed as the 7110-2. It is unknown whether this abandoned numbering scheme ever made it to production.

Intel subsequently developed the 7114-1, a 4-megabit module in a 20-pin package with tinned through-hole pins.

Intel Magnetic Bubble Storage Data Catalog (PDF)
BPK 72 Prototype Kit Datasheet (PDF)
BPK 72 Prototype Kit User's Manual (PDF)
Intel Solutions Bubble Memory Application Note (PDF)
7110 1-Megabit Bubble Memory Datasheet (PDF)
7220-1 Bubble Memory Controller Datasheet (PDF)
7230 Current Pulse Generator Datasheet (PDF)
7242 Dual Formatter/Sense Amplifier Datasheet (PDF)
7250 Coil Pre-Drive Datasheet (PDF)
7254 Quad VMOS Drive Transistors Datasheet (PDF)

Intel 7110-1 1MB bubble memory module. The 7110 was an extremely advanced device at the time of its development, manufactured using a 1.2um synchrotron x-ray lithography process, with a feature size about 6 years ahead of Moore's Law.

One major disadvantage of bubble memory is the large number of specialized driver chips required to drive the memory module and interface it with conventional 5V logic devices. Intel bubble memory support ICs are easily identified by their 72xx part number. Unfortunately, we're missing the two 7254 quad VMOS drive transistors required to implement the 7110.

This article is part of the [Digital Integrated Circuits] exhibit.

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